大家都知道,我们常用的PCB画板工具都是外国工程师研究出来的,所以里面几乎都是英文单词,虽然有些工具软件被翻译成中文,但掌握这些常用的印制电路词汇还是大有好处的。
下面我们来介绍下,
1、基材:base material 2、层压板:laminate 3、覆金属箔基材:metal-clad bade material 4、覆铜箔层压板:copper-clad laminate (CCL) 5、单面覆铜箔层压板:single-sided copper-clad laminate 6、双面覆铜箔层压板:double-sided copper-clad laminate 7、复合层压板:composite laminate 8、薄层压板:thin laminate 9、金属芯覆铜箔层压板:metal core copper-clad laminate 10、金属基覆铜层压板:metal base copper-clad laminate 11、挠性覆铜箔绝缘薄膜:flexible copper-clad dielectric film 12、基体材料:basis material 13、预浸材料:prepreg 14、粘结片:bonding sheet 15、预浸粘结片:preimpregnated bonding sheer 16、环氧玻璃基板:epoxy glass substrate 17、加成法用层压板:laminate for additive process 18、预制内层覆箔板:mass lamination panel 19、内层芯板:core material 20、催化板材:catalyzed board ,coated catalyzed laminate 21、涂胶催化层压板:adhesive-coated catalyzed laminate 22、涂胶无催层压板:adhesive-coated uncatalyzed laminate 23、粘结层:bonding layer 24、粘结膜:film adhesive 25、涂胶粘剂绝缘薄膜:adhesive coated dielectric film 26、无支撑胶粘剂膜:unsupported adhesive film 27、覆盖层:cover layer (cover lay) 28、增强板材:stiffener material 29、铜箔面:copper-clad surface 30、去铜箔面:foil removal surface 31、层压板面:unclad laminate surface 32、基膜面:base film surface 33、胶粘剂面:adhesive faec 34、原始光洁面:plate finish 35、粗面:matt finish 36、纵向:length wise direction 37、模向:cross wise direction 38、剪切板:cut to size panel 39、酚醛纸质覆铜箔板:phenolic cellulose paper copper-clad laminates(phenolic/paper CCL) 40、环氧纸质覆铜箔板:epoxide cellulose paper copper-clad laminates (epoxy/paper CCL) 41、环氧玻璃布基覆铜箔板:epoxide woven glass fabric copper-clad laminates 42、环氧玻璃布纸复合覆铜箔板:epoxide cellulose paper core, glass cloth surfaces copper-clad laminates 43、环氧玻璃布玻璃纤��复合覆铜箔板:epoxide non woven/woven glass reinforced copper-clad laminates 44、聚酯玻璃布覆铜箔板:ployester woven glass fabric copper-clad laminates 45、聚酰亚胺玻璃布覆铜箔板:polyimide woven glass fabric copper-clad laminates 46、双马来酰亚胺三嗪环氧玻璃布覆铜箔板:bismaleimide/triazine/epoxide woven glass fabric copper-clad lamimates 47、环氧合成纤维布覆铜箔板:epoxide synthetic fiber fabric copper-clad laminates 48、聚四乙烯玻璃纤维覆铜箔板:teflon/fiber glass copper-clad laminates 49、超薄型层压板:ultra thin laminate 50、陶瓷基覆铜箔板:ceramics base copper-clad laminates 51、紫外线阻挡型覆铜箔板:UV blocking copper-clad laminates
印制电路基材词汇讲解完毕。 |